Dr. Haoxiang Wang | Semiconductor Processing | Research Excellence Award

Dr. Haoxiang Wang is a distinguished researcher in ultra-precision machining and semiconductor materials processing, focusing on 4H-SiC and AlN. His work combines molecular dynamics simulations and experimental characterization to understand nanoscale deformation, subsurface damage, and ductile–brittle transitions, enabling optimized grinding and chemical mechanical polishing techniques. He has published 17 high-impact papers in leading journals, contributing predictive models and innovative process insights that advance semiconductor manufacturing. His research has garnered 318 citations with an h-index of 8 on Scopus, demonstrating both the quality and influence of his work. His contributions are highly relevant to advancing precision manufacturing technologies.